Photolithography method and system based on high step slope

ABSTRACT

A photolithography method and system based on a high step slope are provided. The method includes: S 1,  manufacturing a sacrificial layer with a high step slope on a substrate; S 2,  adopting a spin-on PR coating process to cover the sacrificial layer with a photoresist layer to form a photolithographic layer; S 3,  forming a mask pattern and a compensation pattern on a mask; and S 4,  performing photolithography processes, by a photolithography machine, on the photolithographic layer. By forming a slope-top compensation pattern and a slope compensation pattern on a mask to perform photolithography on the substrate of a sacrificial layer, a relatively wide compensation pattern is set in a part of the top of the slope with a small thickness, thereby compensating the overexposure at the top of the slope, reducing the error in the photolithographic pattern, and improving the precision of photolithography of the high step slope.

FIELD OF THE INVENTION

The present invention relates to semiconductor technologies, and moreparticularly relates to a photolithography method and system based on ahigh step slope.

BACKGROUND OF THE INVENTION

During the manufacturing of a MEMS surface movable structure, asacrificial layer with a large thickness is often manufactured. Whenetching the sacrificial layer, it always requires that the etchingmorphology has a certain angle, before a movable layer (such as apolysilicon layer) is deposited. In the prior art, when performing aphotolithography process on the slope, as the slope is relatively high(usually the height is greater than 2 μm), after spin-on PR coating, thethickness of the photoresist on the top of the slope and on the bottomof the slope will not be uniform, the photolithography energy for thebottom of the slope during the photolithography process is high, whichwill lead to an overexposure of patterns on the top of the slope.

Therefore, it is necessary to address the above problem and provide aphotolithography method and system based on the high step slope.

SUMMARY OF THE INVENTION

Accordingly, the object of the present disclosure is to provide a highprecision photolithography method and a system based on the high stepslope.

In order to achieve the object of embodiments of the present disclosure,the following technical solutions are provided.

A photolithography method based on a high step slope includes:

S1, manufacturing a sacrificial layer having a high step slope on asubstrate;

S2, coating a photoresist layer on the sacrificial layer by performing aspin-on PR coating process to form a photolithographic layer;

S3, forming a mask pattern and a compensation pattern on a mask, themask pattern is a rectangular across the top of the slope, the slope,and the bottom of the slope, the compensation pattern comprises aslope-top compensation pattern and a slope compensation pattern, theslope-top compensation pattern is a rectangular corresponding to the topof the slope, a length of the rectangular is equal to a width of theslope, a width of the rectangular is greater than a width of the maskpattern, the slope compensation pattern comprises a plurality oftriangles corresponding to the slope, and the slope compensation patternis close to the mask pattern and the slope-top compensation pattern;

S4, a photolithography machine performing one or more photolithographyprocesses to the photolithographic layer using the mask.

As a further improvement of the present disclosure, the slope-topcompensation pattern and the mask pattern are axissymmetric patterns,the slope-top compensation pattern and the mask pattern use the samesymmetry axis extending along a direction of the slope gradient, theslope compensation pattern comprises 4 right triangles.

As a further improvement of the present disclosure, a ratio of a widthof the slope-top compensation pattern to a width of the mask patternranges from 1.2:1 to 1:1.

As a further improvement of the present disclosure, a ratio of a widthof the slope-top compensation pattern to a width of the mask pattern is1.1:1.

As a further improvement of the present disclosure, a height of the highstep slope is greater than 2 μm, an angle of the high step slope rangesfrom 40° to 60°.

As a further improvement of the present disclosure, the sacrificiallayer is made of TEOS or PSG.

As a further improvement of the present disclosure, a thickness of thesacrificial layer is greater than 5 μm.

A photolithography system based on a high step slope includes;

a depositing unit configured to manufacture a sacrificial layer havinghigh step slope on a substrate

a coating unit configured to coat a photoresist layer on the sacrificiallayer by performing a spin-on PR coating process to form aphotolithographic layer;

a photolithography unit configured to perform one or morephotolithography processes to the photolithographic layer, thephotolithography unit is provided with a plurality of masks ofcompensation patterns, the mask includes a mask pattern and acompensation pattern, the mask pattern is a rectangular across the topof the slope, the slope, and the bottom of the slope, the compensationpattern includes a slope-top compensation pattern and a slopecompensation pattern, the slope-top compensation pattern is arectangular corresponding to the top of the slope, a width of therectangular is equal to a width of the top of the slope, a width of therectangular is greater than a width of the mask pattern, the slopecompensation pattern comprises a plurality of triangles corresponding tothe slope, the slope compensation pattern is close to the mask patternand the slope-top compensation pattern.

The advantages of the present disclosure are: by forming a slope-topcompensation pattern and the slope compensation pattern on the mask, aphotolithography process is performed to the substrate of thesacrificial layer having the high step slope, a wide compensationpattern is formed on a part of the top of the slope with a smallthickness. The overexposure on the top of slope can be compensated, anerror of the photolithography pattern can be reduced, a photolithographyaccuracy of the high step slope can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution of the present invention will be clearly andfully described below with reference to the accompanying drawings. It isobvious that the embodiments to be described are only a part rather thanall of the embodiments of the present invention. Persons skilled in theart may derive other embodiments based on the embodiments of the presentinvention without creative efforts, which all fall within the scope ofthe present invention.

FIG. 1 is a flow chart of the photolithography method based on the highstep slope according to one embodiment;

FIG. 2 is a SEM photograph showing the morphology of the photoresist Onthe top and the bottom of the slope after spin-on PR coating accordingto one embodiment;

FIG. 3 is a schematic view of a mask compensation pattern of thephotolithography method and system based on the high step slopeaccording to one embodiment;

FIG. 4 is a SEM photograph showing the morphology of a sacrificial layerafter a photolithography process without using a mask of thecompensation pattern in the prior art;

FIG. 5 is a SEM photograph showing the morphology of the sacrificiallayer after photolithography process using the mask of the compensationpattern.

DETAILED DESCRIPTION OF THE EMBODIMENTS

A photolithography method based on a high step slope includes thefollowing steps.

S1, a sacrificial layer having a high step slope is manufactured on thesubstrate.

S2, a photoresist layer is coated on the sacrificial layer by a spin-onPR coating to form a sacrificial layer.

S3, a mask pattern and a compensation pattern on the mask are formed,the mask pattern is a rectangular across the top of the slope, theslope, and the bottom of the slope. The compensation pattern includes aslope-top compensation pattern and a slope compensation pattern. Theslope-top compensation pattern is a rectangular corresponding to the topof the slope, and its length equals to the width of the top of theslope, its width is greater than the width of the mask pattern. Theslope compensation pattern comprises a plurality of trianglescorresponding to the slope and they are near the mask pattern and theslope-top compensation pattern.

S4, a photolithography machine performs one or more photolithographyprocesses to the photolithographic layer using the mask.

Correspondingly, a photolithography system based on the high step slopeincludes:

a depositing unit configured to manufacture a sacrificial layer havingthe high step slope;

a coating unit configured to coat a photoresist layer on the sacrificiallayer by a spin-on PR coating to form a photolithographic layer;

a photolithography unit configured to perform one or morephotolithography processes to the photolithographic layer. Thephotolithography unit includes a mask having a plurality of compensationpatterns. The mask has mask patterns and compensation patterns. The maskpattern is a rectangular across the top of the slope, the slope, and thebottom of the slope. The compensation pattern includes a slope-topcompensation pattern and a slope compensation pattern. The slope-topcompensation pattern is a rectangular corresponding to the slope top, alength of the slope-top compensation pattern equals to a width of thetop of slope, a width of the slope-top compensation pattern is greaterthan a width of the mask pattern. The slope compensation patterncomprises a plurality of triangles corresponding to the slope, the slopecompensation pattern is close to the mask pattern and the slope-topcompensation pattern.

In the photolithography method and system based on the high step slope,the slope-top compensation pattern and the slope compensation patternare formed on the mask, a photolithography process is performed to asubstrate of the sacrificial layer having high step slope, a widecompensation pattern is set on a thin photolithographic layer on the topof the slope, the overexposure on the top of the slope is thuscompensated, errors of the photolithography pattern can be reduced, aphotolithography accuracy of the high step slope can be improved.

The technical solutions of the present invention will be clearly andcompletely described in the following with reference to the accompanyingdrawings. It is obvious that the embodiments to be described are only apart rather than all of the embodiments of the present invention.Although the present invention has been described with reference to theembodiments thereof and the best modes for carrying out the presentinvention, it is apparent to those skilled in the art that a variety ofmodifications and changes may be made without departing from the scopeof the present invention, which is intended to be defined by theappended claims.

Referring to FIG. 1, a photolithography method based on the high stepslope includes:

S1, a sacrificial layer having the high step slope is manufactured onthe substrate. In the illustrated embodiment, the height of the highstep slope is greater than 2 μm, an angle of the slope ranges from 40°to 60°. The sacrificial layer is made of TEOS or PSG, a thickness of thesacrificial layer is greater than 5 μm.

S2, a photoresist layer is coated on the sacrificial layer by a spin-onPR coating to form a photolithographic layer.

S3, a mask pattern and a compensation pattern are formed on the mask.The mask pattern is a rectangular across the top of the slope, theslope, and the bottom of the slope. The compensation pattern includes aslope-top compensation pattern and a slope compensation pattern. Theslope-top compensation pattern is a rectangular corresponding to the topof the slope, the length of the rectangular is equal to the width of thetop of the slope, the width of the rectangular is greater than the widthof the mask pattern. The slope compensation pattern comprises aplurality of triangles corresponding to the slope, and the slopecompensation pattern is close to the mask pattern and the slope-topcompensation pattern. The slope-top compensation pattern has the samesymmetry axis with the mask pattern. A ratio of the width of theslope-top compensation pattern to the width of the mask pattern rangesfrom 1.2:1 to 1:1. Preferably, in the illustrated embodiment, the ratioof the width of the slope-top compensation pattern to the width of themask pattern is 1.1:1. The slope compensation pattern comprises 4 righttriangles.

S4, the photolithography machine performs one or more photolithographyprocesses to the photolithographic layer.

A spin-on PR coating method in step S2 includes:

A static coating method; the silicon wafer is static, epoxy, spin up(3000 rmp), spin-on PR coating, volatile solvents (original photoresistsolvent accounts for 65% to 85%, the photoresist solvent accounts for10% to 20% after spin-on PR coating).

A dynamic coating method: slowly rotation (500 rpm), epoxy, spin up(3000 rmp), spin-on PR coating, volatile solvents.

Key parameters determining the thickness of the photoresist; theviscosity of the photoresist, the lower the viscosity the thinner thephotoresist; the spin speed, the faster the spin speed the thinner thephotoresist,

Parameters affecting the uniform of the photoresist: rotationalacceleration, the greater the rotational acceleration the more uniformthe photoresist will be, the uniform of the photoresist is related tothe time of rotational acceleration.

A 3±0.3 μm wide line is manufactured on a 6 μm thick slope made of TEOS,a 6 μm thick photoresist is coated on a 6 μm thick slope, after spin-onPR coating, the morphology is shown as FIG. 2, the SEM magnification is10000 times, a thickness of the photoresist on the top of the slope is1.70 μm, a thickness of the photoresist on the bottom of the slope is6.41 μm.

The mask is very important when fabricating the integrated circuit, asthe mask contains pattern information of a specific layer of theintegrated circuit, a horizontal structure and a size of each layer ofthe integrated circuit are determined by the mask. A minimum of times ofperforming the photolithography process in the manufacturing process isdetermined by the number of the masks.

A layout is needed when manufacturing the mask, the layout is a designrule determined according to the circuit, a geometric shape and size ofthe device, and the fabricating process of the integrated circuit. Thelayout is a mask pattern designed by computer aided design.

The mask pattern in the illustrated embodiment includes a plurality ofcompensation patterns, the compensation pattern compensates the patternon the top of the slope and on the slope in the mask, and a line widthof the pattern on the top of the slope and on the slope and on thebottom of the slope will be the same.

Referring to FIG. 3, the mask pattern 10 and the compensation patternare formed on the mask. The mask pattern 10 is a rectangular across thetop of the slope, the slope, and the bottom of the slope. Thecompensation pattern includes a slope-top compensation pattern 21 and aslope compensation pattern 22. The slope-top compensation pattern 21 isa rectangular corresponding to the top of the slope, the length of therectangular equals to the width of the top of the slope, the width ofthe rectangular is greater than the width of mask pattern 10. The slopecompensation pattern 22 comprises a plurality of triangles correspondingto the slope, The slope compensation pattern 22 is close to the maskpattern 10 and the slope-top compensation pattern 20. In the illustratedembodiment, the slope-top compensation pattern 21 and the mask pattern10 are both axissymmetric patterns, and they have the same symmetryaxis. The slope compensation pattern 22 comprises four right triangles,the four right triangles are located on the upper part and the lowerpart of the slope-top compensation pattern 21.

Preferably, the slope in the illustrated embodiment is substantially aplane, the slope compensation pattern 12 is a right triangle. In otherembodiment, if the slope is a curved surface, the slope compensationpattern 12 may not a right triangle, two sides of the slope compensationpattern 12 are right angles, the other side is a curve.

After the mask pattern and the compensation pattern are formed on themask, the patterns on the mask are aligned with the substrate having ahigh step slope sacrificial layer, and the substrate is exposed, thusthe patterns are copied.

Correspondingly, a photolithography system based on the high step slopeincludes:

A depositing unit configured to manufacture a sacrificial layer having ahigh step slope on the substrate.

A coating unit configured to coat a photoresist layer on the sacrificiallayer by performing a spin-on PR coating process to form aphotolithographic layer.

A photolithography unit configured to perform one or morephotolithography processes to the photolithographic layer, thephotolithography unit includes a mask having a mask pattern and acompensation pattern.

Referring to FIG. 3, a mask pattern 10 and a compensation pattern areformed on the mask, the mask pattern 10 is a rectangular across the topof the slope, the slope, and the bottom of the slope. The compensationpattern includes a slope-top compensation pattern 21 and a slopecompensation pattern 22. The slope-top compensation pattern 21 is arectangular corresponding to the top of the slope, a length of therectangular is equal to the width of the slope, a width of therectangular is greater than the width of the mask pattern 10. The slopecompensation pattern 22 comprises a plurality of triangles correspondingto the slope, the slope compensation pattern 22 is close to the maskpattern 10 and the slope-top compensation pattern 20. In the illustratedembodiment, the slope-top compensation pattern 21 and the mask pattern10 have the same symmetry axis. The slope compensation pattern 22comprises 4 right triangles, the 4 right triangles are located. on theupper part and on the lower part of the slope-top compensation pattern21.

Preferably, the slope in the illustrated embodiment is substantially aplane, the slope compensation pattern 22 is right triangles. In analternative embodiment, if the slope is a curved surface, the slopecompensation pattern may not be right triangles, the slope compensationpattern can be set as that two sides are right triangles, and the otherside is a curve.

Referring to FIG. 4 and FIG. 5, FIG. 4 is a morphology of thesacrificial layer after exposing without using the compensation pattern,and FIG. 5 is a morphology of the sacrificial layer after exposing usingthe mask of the compensation pattern.

A compensation pattern is not used when obtaining FIG. 4, a thickness ofthe photoresist on the top of the slope is smaller than a thickness ofthe photoresist on the slope and on the bottom of the slope, thus thetop of the slope may be over exposed, the slope may also be over exposedin some extent, and the photolithography line width on the top of theslope is large, the photolithography line width on the bottom of theslope is small. Referring to FIG. 4, the SEM magnification is 12000times, the top of the slope and the bottom of the slope are measured,the line widths are 186 μm, 3.81 μm, 2.54 μm, 2.71 μm, and 3.27 μmrespectively, the line width has an error of about 1 μm, which cannotmeet the requirement of high precision photolithography,

A mask of the compensation pattern is used to expose when obtaining FIG.5. On the top of the slope where a thickness of the photoresist issmall, a wide compensation pattern is formed on the mask, it can be usedto compensate the overexposure. Referring to FIG. 5, the SEMmagnification is 12000 times, the top and the bottom of the slope aremeasured, the line widths are 3.12 μm, 3.39 μm, 3.07 μm, and 3.66 μmrespectively, the line width of the pattern is about 3.3 μm, an error ofthe line width is smaller than 0.6 μm, which meets an accuracyrequirement of ±0.3 μm.

The slope-top compensation pattern and the slope compensation patternare formed on the mask, a photolithography process is performed to thesubstrate of the sacrificial layer having the high step slope, a widecompensation pattern is formed on a part of the top of the slope with asmall thickness. The overexposure on the top of slope can becompensated, an error of the photolithography pattern can be reduced, aphotolithography accuracy of the high step slope can be improved.

Although the present invention has been described with reference to theembodiments thereof and the best modes for carrying out the presentinvention, it is apparent to those skilled in the art that a variety ofmodifications and changes may be made without departing from the scopeof the present invention, which is intended to be defined by theappended claims.

What is claimed is:
 1. A photolithography method based on a high stepslope, comprising: S1, manufacturing a sacrificial layer having a highstep slope on a substrate; S2, coating a photoresist layer on thesacrificial layer by performing a spin-on PR coating process to form aphotolithographic layer; S3, forming a mask pattern and a compensationpattern on a mask, wherein the mask pattern is a rectangular across thetop of the slope, the slope, and the bottom of the slope, thecompensation pattern comprises a slope-top compensation pattern and aslope compensation pattern, the slope-top compensation pattern is arectangular corresponding to the top of the slope having a length equalto a width of the slope, and a width greater than a width of the maskpattern, the slope compensation pattern comprises a plurality oftriangles corresponding to the slope adjacent to the mask pattern andthe slope-top compensation pattern; S4, performing one or morephotolithography processes, by a photolithography machine, to thephotolithographic layer using the mask.
 2. The method according to claim1, wherein the slope-top compensation pattern and the mask pattern areaxisymmetric patterns, and the slope-top compensation pattern and themask pattern share the same symmetry axis extending along a direction ofthe slope gradient, the slope compensation pattern comprises four righttriangles.
 3. The method according to claim 2, wherein a ratio of awidth of the slope-top compensation pattern to a width of the maskpattern ranges from 1.2:1 to 1:1.
 4. The method according to claim 2,wherein a ratio of a width of the slope-top compensation pattern to awidth of the mask pattern is 1.1:1
 5. The method according to claim 1,wherein a height of the high step slope is greater than 2 μm, an angleof the high step slope ranges from 40° to 60°.
 6. The method accordingto claim 1, wherein the sacrificial layer is made of TEOS or PSG.
 7. Themethod according to claim 6, wherein a thickness of the sacrificiallayer is greater than 5 μm.
 8. A photolithography system based on a highstep slope, comprising: a depositing unit configured to manufacture asacrificial layer having high step slope on a substrate; a coating unitconfigured to coat a photoresist layer on the sacrificial layer byperforming a spin-on PR coating process to form a photolithographiclayer; a photolithography unit configured to perform one or morephotolithography processes to the photolithographic layer, wherein thephotolithography unit comprises a plurality of masks of compensationpatterns, the mask comprises a mask pattern and a compensation pattern,the mask pattern is a rectangular across the top of the slope, theslope, and the bottom of the slope, the compensation pattern comprises aslope-top compensation pattern and a slope compensation pattern, theslope-top compensation pattern is a rectangular corresponding to the topof the slope having a length of the rectangular equal to a width of thetop of the slope, and a width greater than a width of the mask pattern,the slope compensation pattern comprises a plurality of trianglescorresponding to the slope adjacent to the mask pattern and theslope-top compensation pattern.